Thintronics wins proposed US CHIPS incentives for advanced substrate technology
News Source : Digitimes
News Summary
- Thintronics wins proposed US CHIPS incentives for advanced substrate technology.
- Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research and Development Office for up to US$50 million in incentives.
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