Hanmi targets advanced packaging market with FC Bonder 3.5

Image for article Hanmi targets advanced packaging market with FC Bonder 3.5
News Source : Digitimes

News Summary

  • New flip-chip bonding tool for AI system semiconductor packaging.
  • For confidential support call the Samaritans on 08457 90 90 90 or visit a local Samaritans branch, see www.samaritans.org for details.
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