News Summary

• The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC.
• In this design, the application processor (AP) and DRAM are positioned next to each other on the substrate rather than stacked.
• Samsung is expected to use the Exynos 2700 in the Galaxy S27 and Galaxy S 27+, both of which are likely to launch in early 2027.
• It will be interesting to see how the chipset’s new packaging design will impact thermal performance and overall efficiency.