News Summary

• Samsung Electronics is making a significant design change for its next-generation mobile processor.
• The company plans to abandon the advanced Fan-Out Wafer Level Packaging (WLP) technology it has used since the Exynos 2400.
• While WLP improved thermal management, manufacturing costs have proven too high to maintain profitability.
• Instead of WLP, Samsung will implement a Side-by-Side (SbS) architecture.
• This design places the mobile processor and DRAM horizontally on the same substrate rather than stacking DRAM vertically above the processor.